Note on Conductive Heat Transfer from a Fine Wire.
Expert InsightsPublished 1964
The analysis of Lees and Liu of thermal conductive heat transfer from a fine wire is extended to include arbitrary values of a thermal accommodation coefficient. The implications for experimental studies are examined with particular reference to the criterion for the applicability of free molecule flow theory in the interpretation of results.
Document Details
- Copyright: RAND Corporation
- Availability: Web Only
- Year: 1964
- Pages: 9
- Document Number: P-2843
Citation
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